Schneider Electric, the global leader in digital energy management and automation, has unveiled its most comprehensive portfolio of end-to-end liquid cooling solutions for hyperscale, colocation, and high-density data centre environments. The new Motivair by Schneider Electric portfolio is engineered to support the power and GPU-intensive demands of next-generation AI, HPC, and accelerated computing workloads.
The launch marks the company’s first full showcase of liquid cooling capabilities since acquiring a controlling stake in Motivair in February 2025. Available globally, the portfolio combines liquid and air-cooled technologies with software and services — creating a complete framework to enable AI Factories of the Future.
Meeting Rising AI Demands
As data centre rack densities surpass 140kW — and provision for future densities exceeding 1MW — traditional air cooling is no longer sufficient. AI chips are becoming hotter and denser, driving the need for liquid cooling to maintain performance and uptime. Cooling already accounts for up to 40% of a data centre’s power budget, and direct liquid cooling is up to 3,000 times more effective at removing heat than air.
Deploying liquid cooling, however, is complex, requiring integrated infrastructure, software, and global support. Schneider Electric and Motivair address this by providing a unified portfolio that spans hardware, software, and services, backed by robust global supply chains.
“We are the only liquid cooling provider with proven expertise at the silicon level, co-developing solutions with NVIDIA and other leading GPU manufacturers,” said Richard Whitmore, CEO of Motivair by Schneider Electric. “Together with Schneider Electric, we are delivering unmatched capabilities that compress time-to-market and boost ROI for customers worldwide.”
A Complete Liquid Cooling Portfolio
The Motivair by Schneider Electric range delivers precise thermal control for AI workloads, including:
Coolant Distribution Units (CDUs): Scalable from 105kW to 2.5MW, enabling performance for six of the world’s top 10 supercomputers. Certified for NVIDIA’s latest hardware.
ChilledDoor® Rear Door Heat Exchangers: Rack-agnostic design cooling up to 75kW — ideal for GPU-intensive workloads.
HDU™ (Heat Dissipation Unit): Compact footprint, capable of 100kW rejection and creating water loops for up to 132kW of capacity.
Chillers & TCS Loops: Air-cooled chillers reduce water usage by millions of gallons annually while delivering up to 20% higher performance.
EcoStruxure Software: Schneider’s platform for optimizing thermal management and operational efficiency.
Services: More than a decade of deployment expertise with the world’s largest installed base of liquid cooling. Over 600 field service technicians and EcoXpert partners are being trained globally.
Backed by Global Manufacturing and Testing
Schneider Electric and Motivair’s portfolio is supported by an expanding manufacturing footprint, including a new production facility in Buffalo, New York, and expanded operations in Italy and India, tripling global output. Every solution undergoes rigorous real-world thermal and mechanical testing before deployment, ensuring reliability and reduced risk.
“AI has made liquid cooling a strategic imperative,” said Andrew Bradner, Senior Vice President, Cooling Business, Schneider Electric. “Our combined expertise, global reach, and rigorous validation set a new benchmark for data centre cooling.”
Industry analysts agree. Olga Yashkova of IDC noted: “With Motivair, Schneider Electric becomes the only single vendor able to design and supply all power and cooling infrastructure for AI data centres, simplifying deployment while reducing complexity.”